Alexander Bietsch

Senior Backend Integration Engineer at Aledia

Alexander Bietsch is a seasoned engineering and research professional with extensive experience in backend integration and optical technologies. Currently serving as a Senior Backend Integration Engineer at Aledia since January 2021, Alexander focuses on packaging and process definitions while collaborating with external subcontractors. Previously, a longstanding tenure at ams AG included roles as R&D Manager, where responsibilities encompassed leading teams in wafer-scale optical master production and materials characterization. Earlier positions at Oerlikon, the University of Basel, and IBM involved significant advancements in process development for optical components, sensor functionalization, and hard disc technologies. Alexander holds a PhD in Physics from Ulm University and completed management training at Malik International AG.

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Grenoble, France

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Aledia

Aledia develops and manufactures innovative light-emitting diodes based on a unique 3D architecture using gallium-nitride on-silicon microwires.The technology uses standard silicon wafers with diameters of 8 inches (200 mm) and existing CMOS wafer-fabrication processes and tools, enabling the production of LED chips at 25 percent of the cost oftraditional planar LED chips. The process and tools help develop both mobile displays and microdisplays for AR/VR applications, enabling users to use them for direct-view displays such as for smartphones, smartwatches, tablets, and laptops. In 2011, Giorgio Anania, Philippe Gilet, and Xavier Hugon co-founded the Grenoble, Rhone-Alpes-based company.


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51-200

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