Amkor Technology
Mr. Liao was appointed to our Board of Directors in June of 2019. Mr. Liao has been a senior executive at Lam Research, a semiconductor processing equipment company, since 1993 and currently serves as Chairman of Lam Asia Pacific Operations (Taiwan, China and Southeast Asia regions), where he has been a major contributor to the global product development, strategic planning, growth and success of Lam’s multi-billion dollar Asia Pacific business. Prior to joining Lam, Mr. Liao held engineering management and technology leadership positions at Integrated Device Technology in Santa Clara from 1988 to 1993 and Intel Corporation in Livermore and Santa Clara from 1984 to 1988. Mr. Liao holds a Bachelor’s degree in Electrical Engineering from National Cheng Kung University in Taiwan, and a Master’s degree in Electrical Engineering and Applied Physics from Case Western Reserve University.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.