Amkor Technology
Ian Lao is an experienced professional in strategic and competitive intelligence, currently serving as the Director of Strategic & Competitive Intelligence at Amkor Technology since 2013. Previous roles include Senior Business Intelligence Analyst at ON Semiconductor, where market analysis of emerging technology trends was a primary focus, and Senior Analyst at In-Stat, specializing in semiconductor enabling technologies. Ian's earlier career includes significant contributions at Microchip Technology in various capacities, including Product Marketing Manager and Strategic Marketing Manager, overseeing product development and marketing strategies for embedded controllers. Ian also held engineering positions at STMicroelectronics, 8x8, Inc., and Integrated Information Technology, focusing on product development and marketing collateral. Educational qualifications include an MBA in Technology Management from the University of Phoenix and a BSEE in Electrical Engineering from San José State University.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.