Amkor Technology
Jon Aday is an experienced professional in advanced packaging technology with a career spanning multiple key roles in the semiconductor and biotechnology industries. Currently serving as VP of Advanced Packaging Technology Integration at Amkor Technology, Inc. since January 2021, Jon previously held positions including Sr. Staff Engineer at Illumina, where support was provided for new product development in DNA sequencing consumables. Prior roles at Qualcomm involved driving semiconductor packaging technology development and managing engineering teams. Jon's extensive experience includes significant contributions to FlipChip International and multiple roles at Amkor Technology, where leadership was demonstrated in high-performance flip chip products. Education includes a Master's and Bachelor's degree in Electrical Engineering from Auburn University.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.