Amkor Technology
Ken Stratton is a seasoned executive with extensive experience in the technology industry, currently serving as Senior Vice President of the fcCSP Advanced Products Business Unit at Amkor Technology, Inc. since October 2010. Stratton's leadership style emphasizes extreme ownership, fostering a high-energy culture dedicated to growth and innovation within diverse technology segments such as Automotive, IoT, Computing, AR/VR, and 5G. Prior to Amkor, Stratton held various engineering and management positions at IBM from April 1996 to October 2010, including Senior Manufacturing Quality & Development Engineer, where responsibilities included overseeing quality assurance for global manufacturing. Stratton holds a Bachelor’s Degree in Mechanical Engineering from the University of Vermont and an Associate’s Degree in Mechanical Engineering/Mechanical Technology from Vermont Technical College.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.