Amkor Technology
Megan Faust joined Amkor in 2005 and has served in various finance and accounting positions, including six years as Corporate Controller. Prior to joining Amkor, she served as an auditor with KPMG, LLP for 10 years, including a two-year international assignment in Munich, Germany. Megan holds an MBA from the W.P. Carey School of Business at Arizona State University, as well as a BS in Accountancy from Northern Arizona University and is a Certified Public Accountant in Arizona.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.