Amkor Technology
Michael Lloyd is a seasoned finance professional with extensive experience in financial planning and analysis. Currently serving as Senior Manager of FP&A at Amkor Technology, Inc. since May 2018, Michael previously held various finance roles at JDA Software from August 2012 to May 2018, including Finance Business Partner and Senior Financial Analyst. Earlier experience includes an Associate Consultant position at Semler Brossy Consulting Group and an Internal Audit Internship at Insight. Michael earned a Bachelor's degree in Finance from the University of Arizona - Eller College of Management in 2010.
Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.