Amkor Technology
Prasad Dhond is a seasoned executive with extensive experience in the semiconductor industry, currently serving as Vice President of WBBGA and QFN Products at Amkor Technology, Inc. since February 2014, where responsibilities include managing the respective product lines. Dhond previously held the role of Vice President & General Manager for Automotive at Amkor, where a strategic focus on Advanced Driver-Assistance Systems (ADAS) and electrification was established by creating a cross-functional task force. Prior experience includes a tenure at Texas Instruments from July 2002 to February 2014, where roles encompassed Marketing Manager positions in Lighting Power Products and Smart Grid Home Area Networks, as well as System Engineering Manager and Applications and Product Marketing Engineer. Prasad Dhond holds a Bachelor of Science in Electrical Engineering from The University of Texas at Austin and an MBA from SMU Cox School of Business.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.