Amkor Technology
Steve Shin was appointed as Amkor’s Head of Worldwide Manufacturing Operations in March 2021. Prior to assuming his current role, Mr. Shin served as Head of Corporate Manufacturing & Amkor’s Corporate Procurement Center. Since joining Amkor in 2001, Mr. Shin has also served as Senior Vice President in Procurement, PC, IE, Facility and Logistics in Amkor Technology China. Mr. Shin has more than 30 years of experience in the electronics and semiconductor industry, and he holds a Bachelor’s degree in Electronics Material Science from the University of Inha in Korea.
This person is not in any offices
Amkor Technology
3 followers
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.