Amkor Technology
Suresh Jayaraman is a seasoned professional with extensive experience in the semiconductor industry, currently serving as Senior Director at Amkor Technology, Inc. since October 2016, focusing on HDFO Development within the Advanced Wafer Level Development Organization. Prior to this role, Suresh held the position of New Product Program Manager at Deca Technologies and worked as a Senior Manager at Amkor Technology from March 2004 to March 2012. Suresh's earlier roles include Senior Packaging Engineer and Sr. Packaging Engineer at Skyworks Solutions and FC Packaging Engineer at Kyocera America, Inc. Suresh holds degrees from the Birla Institute of Technology and Science, Pilani (1989-1994) and Binghamton University (1996-1998).
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.