Amkor Technology
Troy Philbert is a seasoned executive in information technology and enterprise applications, currently serving as Chief Information Officer and Senior Vice President of Enterprise Applications at Amkor Technology, Inc. since July 2022. Prior to this role, Troy held various leadership positions at onsemi from December 2006 to July 2022, including Vice President of Enterprise Applications and Senior Director of Enterprise Applications and Shared Services. Previously, Troy worked as IT Manager at Worthington Industries from 1994 to 2006. Troy holds an MBA in Marketing from The Ohio State University (1997-1999) and a Bachelor of Science in Electrical and Computer Engineering from the University of Missouri-Columbia (1990-1994).
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.