Amkor Technology
Tseng-Cheng Huang currently serves as a Senior Department Manager in Product Engineering at Amkor Technology, focusing on 200mm and 300mm bumping NPI, process integration, development, standardization, problem solving, quality systems, operational KPI management, and new material implementation since December 2014. Prior to this, Tseng-Cheng worked at TSMC as a Lithography Process Section Manager from December 2000 to December 2014, where responsibilities included managing lithography, TSV, and MEMS process development, as well as quality and productivity improvements. Earlier roles included Process Engineer at TI-ACER, focusing on technology transfer and yield improvement, and Manufacturing Supervisor at Mosel, overseeing labor management and production planning. Tseng-Cheng holds a Bachelor's degree in Industrial Engineering from Tunghai University, obtained between 1991 and 1995.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.