Amkor Technology
Yoann Robillard serves as Vice President of Sales - Strategic Accounts at Amkor Technology, Inc., a position held since January 2014, where responsibilities include managing teams and driving strategic alignment across various business units. Previously, Yoann held several roles at Texas Instruments from September 1999 to December 2013, culminating as Business Line Director for the OMAP Embedded Processing Business Unit, where significant contributions were made to the launch of the Smart Home business line. Additionally, Yoann amassed extensive experience in business development and product management, supervising multiple teams and enhancing product strategies across various market segments. Educational background includes an Engineering Degree in Electronics and Computer Sciences from E.S.E.O. and a DUT in Electronics, Electrotechnics, and Computer Sciences.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.