Anurag Yadav

Principal Engineer (product Management Technical) at ASM International NV

Anurag Yadav is an experienced engineering professional specializing in quality and reliability within the semiconductor and electronic materials industries. Currently serving as Principal Engineer in Global Quality Engineering at ASM since December 2021, Anurag previously held roles as Senior Quality Engineer at the same company and Quality Engineer at EMD Electronics, where responsibilities included leading customer complaint investigations and coordinating audits. Anurag's tenure at Intel Corporation and RFMD involved lithography process engineering, focusing on advanced semiconductor technologies and substrates. Prior experience includes process engineering at Qimonda and an internship at Xanodics Inc., where Anurag developed manufacturing processes for photoresists and capacitors. Holding a Master’s degree in Microelectronics Photonics from the University of Arkansas, Anurag combines a strong educational background with extensive industry experience.

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Phoenix, United States

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ASM International NV

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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.


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1,001-5,000

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