ASM International NV
Sue Wong is an accomplished mechanical engineer with extensive experience spanning over two decades. Currently serving as a Senior Mechanical Engineer II at ASM since November 2021, Sue specializes in mechanical design for XP8 atomic layer deposition systems. Prior to this role, Sue was a Senior Mechanical Design Engineer at SMART Embedded Computing, focusing on designing 19" rack enclosures for the rail transportation industry. As a former business owner of Ubi LLC, Sue oversaw the design and manufacturing of modern diaper changing tables, managing product development, marketing, supply chain, sales, and finance. Sue's earlier experience includes serving as a Senior Mechanical Engineer and Manager at Motorola, where project oversight and team management were key responsibilities, and as a Mechanical Engineer at Honeywell, contributing to circuit board assembly designs for NASA's International Space Station. Sue holds a Bachelor's degree in Mechanical Engineering from the Massachusetts Institute of Technology and an MBA from Arizona State University.
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ASM International NV
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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.