Axus Technology
David Gerecke is a seasoned mechanical and electromechanical engineer with extensive experience in the semiconductor industry and freelance design. Currently serving as a Mechanical Engineer and Designer at Axus Technology since August 2018, David also operates as a Freelance Designer specializing in Electro-Mechanical Design since May 2014. Prior roles include Electromechanical Designer at Phoenix Systems and Technology, where David contributed to the design of a plasma process chamber, and Electromechanical Design Engineer at Teikoku Taping Systems, Inc., focusing on semiconductor process equipment. David has also held positions in diverse engineering and technical capacities at UTC Aerospace Systems, Suss Microtec, and Aviata Systems, with a foundational education in Electrical Engineering Technology.
Axus Technology
Axus Technology delivers advanced process development expertise, equipment, and service support for: -- CMP & Polishing -- Wafer Thinning and Grinding -- Edge Grinding and Profline -- Substrate Cleaning Applications -- Wafer Bonding Applications. Axus' customers range from leading-edge production semiconductor manufacturers through small development facilities. We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner. Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment. The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.