Axus Technology
Frank Root is a highly experienced Mechanical Engineer with over four decades in the industry, specializing in conceptual and mechanical design across various sectors including semiconductor, defense, and automation. Currently employed at Axus Technology since April 2018, Frank is responsible for the design of semiconductor capital equipment and serves as a SolidWorks CAD and PDM Administrator. Previous experience includes consulting roles at Sharp Technologies and FDR Innovative Design LLC, as well as positions at CollabraTech Solutions, Ultra Clean Technology, Novellus Systems, Ryobi Outdoor Products, Hughes Aircraft Company, Deutsch Fastener Corporation, and Rockwell International. Frank holds a rich background in multi-customer engineering, design for manufacturing, and has garnered a strong foundation in CAD software, including SolidWorks and PTC Creo. Educational qualifications include coursework in Mechanical Engineering from El Camino College and a High School Diploma focusing on Mechanical Design and Engineering.
Axus Technology
Axus Technology delivers advanced process development expertise, equipment, and service support for: -- CMP & Polishing -- Wafer Thinning and Grinding -- Edge Grinding and Profline -- Substrate Cleaning Applications -- Wafer Bonding Applications. Axus' customers range from leading-edge production semiconductor manufacturers through small development facilities. We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner. Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment. The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.