Ehsan Kargaran

Senior Staff RFIC Design Engineer & Technical RX Lead at Bridgecom Semiconductors

Ehsan Kargaran is an accomplished Senior Staff RFIC Design Engineer and Technical RX Lead at Bridgecom Semiconductors since March 2023, with a strong background in RF and analog design across multiple leading technology companies. Prior roles include Principal Analog & RFIC Design Engineer at Thalia, where Ehsan designed RF blocks for LB applications and redesigned PMIC blocks, and RFIC Design Engineer at Qualcomm, focusing on GNSS applications. At Infineon Technologies, extensive experience was gained in designing components for 5G applications, including transceivers and amplifiers. Ehsan holds a Ph.D. from Università di Pavia, which was complemented by internships at MediaTek and Marvell Semiconductor, along with teaching experience at Sadjad University of Technology. Educational qualifications include a Master's degree in Microelectronic Engineering and a Bachelor's degree in Electrical and Electronics Engineering.

Location

Munich, Germany

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Bridgecom Semiconductors

At Bridgecom, we bring together centuries of combined experience in the wireless semiconductor industry. Started-up and headquartered in Europe, Bridgecom has gathered senior industry experts, a growing engineering team and a partner network synthesizing experience and technologies into chipset products. With deep expertise, we turn connectivity into reality, shaping the future of semiconductors in close collaboration with our customers. We are committed to excellence in every step, driving innovation and reliability in the solutions we provide.


Headquarters

Munich, Germany

Employees

51-200

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