Bridgecom Semiconductors
Jianwei Liu currently serves as VP of Baseband Engineering at United Micro Technology, focusing on developing cost-effective 5G IoT solutions. Prior to this role, Jianwei Liu spent over a decade at Intel Corporation, initially as a Senior Engineer and then progressing to Principal Engineer, contributing to networking switch SoCs and next-generation 5G SDR designs, and leading advancements in LTE/5G FEC decoding and SoC integration from 22nm to 10nm processes. Earlier experience includes a Senior Staff position at Marvell Semiconductor, Inc. overseeing SoC clocking and power management, as well as involvement in Xscale architecture design at Intel between 2000 and 2006. Jianwei Liu holds a degree from The University of Manchester.
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Bridgecom Semiconductors
At Bridgecom, we bring together centuries of combined experience in the wireless semiconductor industry. Started-up and headquartered in Europe, Bridgecom has gathered senior industry experts, a growing engineering team and a partner network synthesizing experience and technologies into chipset products. With deep expertise, we turn connectivity into reality, shaping the future of semiconductors in close collaboration with our customers. We are committed to excellence in every step, driving innovation and reliability in the solutions we provide.