Zeki Celik

Zeki Celik is a Principal Engineer at Broadcom Inc., where expertise encompasses thermal and mechanical engineering with a focus on electronics packaging, spanning from die (chip) level to system level thermal measurements and characterization since May 2014. Previously, Zeki Celik held the same title at LSI from March 1996 to May 2014. Academic qualifications include a Ph.D. in Aero/Astro (major) and Mechanical Engineering (minor) and a Master of Science in Aero/Astro from Stanford University, along with a Bachelor of Science and Master’s degree in Mechanical Engineering from Orta Doğu Teknik Üniversitesi.