Deca Technologies
Tim Olson has extensive work experience in the semiconductor industry. Tim served as the CEO and Founder of Deca Technologies, where they developed and implemented M-Series electronic interconnect technology. Tim also served as the Founder, President, and CEO of Deca Technologies, focusing on wafer level packaging and fan-out technology. Prior to that, they worked at Amkor Technology as the Senior Vice President of R&D and Emerging Technologies, leading innovations in packaging technology. Tim also held positions at MCT - Micro Component Technology as the Executive Vice President of Products & Operations and at Fico b.v (now BESI) as the Vice President of the System Integration Division. Tim Olson began their career at Motorola as an Operations Manager, where they played a key role in the development of automated semiconductor assembly and testing processes.
Tim Olson received their Associate Degree in Physical Sciences from Fergus Falls Community College between 1980 and 1982. Afterwards, they pursued a dual Bachelor of Science degree in Engineering and Management at the University of North Dakota from 1982 to 1986.
Deca Technologies
Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, our 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies. From initial applications in traditional semiconductor packaging, to the growth of chiplets and heterogeneous integration, we have created key foundational building blocks for the future. Our world class investors, including Infineon, Qualcomm, ASE, nepes and SunPower, are respected industry leaders who provide us with the strength and visibility to create an entirely new model. Our flagship product, M-Series™, is a rugged, fully molded fan-out wafer-level package (FOWLP) that provides exceptional reliability, performance, and quality; all in a miniaturized format. M-Series FX is designed into most of the leading smartphones around the globe with annual shipment volumes in the hundreds of millions. Adaptive Patterning™ (AP) fundamentally revitalizes the spirit of innovation in manufacturing. Extending beyond traditional Design for Manufacturing (DFM), our unique Design-During-Manufacturing (DDM) adapts each design in real-time to accommodate natural process variation producing perfectly aligned interconnects every time on every device. Through the divestiture of our manufacturing operations in early 2020, we transformed into a pure-play technology provider. We are building upon our highly successful technology transfer and license agreements with ASE and nepes to make M-Series and AP technologies available to the industry as emerging standards for advanced fan-out and related technologies.