Chase Ranicke

Chase Ranicke is a Mechanical Applications Engineer at Dematic since June 2020. Prior experience includes serving as an Additive Manufacturing Intern at Engman-Taylor Company, Inc. from May to August 2019 and an Undergraduate Research Assistant at the University of Wisconsin-Milwaukee from September 2017 to May 2019. During the undergraduate role, Chase contributed to the development of 3D printer filament from "smart" materials, facilitating weekly group meetings to set goals and track progress. Additional experience includes a Co-op as an Application Engineer at Modine Manufacturing Company from May 2018 to January 2019, where responsibilities involved failure analysis, creating Design Verification Plans, and coordinating inter-departmental meetings. Chase holds a degree in Mechanical Engineering with a focus on Additive Manufacturing from the University of Wisconsin-Milwaukee, completed in 2020.