Hardeep Heer

VP, Engineering & Chief Technology Officer at Firan Technology Group Corp

Hardeep Heer holds a degree in Mechanical Engineering. Mr. Heer has been in the Printed Circuit Board industry since the early 1980s. Prior to joining FTG as Vice President Engineering & Chief Technology Officer, he held senior positions with major Printed Circuit Board manufacturing companies in the U.S. and Canada. His over 30+ years of experience in this industry includes setting up two advanced Printed Circuit Board manufacturing shops. In his present position, Mr. Heer is responsible for the development/introduction of new technologies to FTG.


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Firan Technology Group Corp

Firan Technology Group Corporation (FTG) is a supplier of aerospace and defense electronic products and subsystems. The Company operates through two segments: FTG Circuits and FTG Aerospace. The FTG Circuits is a manufacturer of technology printed circuit boards. Its product offering includes engineering services, Microvia technology, buried capacitance, cavity boards, metal core constructions, multiple sequential laminations, differential and controlled impedance, embedded filters and inductors, buried resistor layers, back drilling and back planes. It serves customers in aviation, defense and other technology industries. FTG Aerospace designs and manufactures illuminated cockpit panels, keyboards, bezels, subassemblies and assemblies for original equipment manufacturers of avionics products, as well as for airframe manufacturers. These products are devices that display information and contain buttons and switches that can be used to input signals into an avionics box or aircraft.


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501-1,000

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