Dean Zavadsky

Dean Zavadsky has over 23 years of experience in hardware engineering and research and development. Dean has worked for several companies including GenXComm Inc., CommScope, TE Connectivity, ADC, and Agilent Technologies.

At GenXComm Inc., they currently serve as the Sr. Director of Hardware Engineering. At CommScope, they served as the Director of Research and Development from 2015 to 2021. In this role, they were responsible for growing broad-scope global technology teams, focused on DAS and small cell research and product development. Dean also earned “master inventor” recognition in 2019 for 25-plus U.S. patents. Additionally, they served as the Principal Engineer / Engineering Manager, responsible for DAS feature and architecture investigations, and leadership of the HW engineering team in Minnesota.

From 2010 to 2015, they worked at TE Connectivity as the Principal Engineer / Engineering Manager. Dean was the Core Team Lead for the rapid development of an industry first CPRI optical interface between Alcatel-Lucent 3G and 4G eNBs, and TE's Flexwave DAS. Dean also maintained several leadership and technical roles, including primary technical interface to ALU, HW design engineer, and project responsibility for budget, staffing, schedule, contract review, IP disclosure, customer demonstrations, and communication of program status to TE executive leadership.

At ADC, they worked from 2004 to 2010 as the Principal RF Engineer / Engineering Manager and Sr. Project Electrical Engineer. As the Principal RF Engineer / Engineering Manager, they were a member of the HW design and architecture team responsible for developing a first-in-industry multi-band digital DAS. As the Sr. Project Electrical Engineer, they were responsible for HW subsystem partitioning, selection and HW design of critical FPGAs and data converter circuits, design of clock generation and ADC/DAC interface circuits, duplexer-embedded RF power detectors and LNAs, and filter/duplexer specifications.

Finally, at Agilent Technologies, they worked from 1998 to 2004 as an R&D Engineer and NPI / MFG Development Engineer. As the R&D Engineer, they were the primary analog/RF design engineer for the Advanced Products Organization (APO). As the NPI / MFG Development Engineer, they were assigned widely varying engineering tasks in support of production microwave vector network analyzers.

Dean Zavadsky attended the University of Wisconsin-Madison from 1993 to 1998, where they earned a Bachelor of Science in Electrical and Computer Engineering.