Herrmann Ultrasonics
Daniel Mendoza is currently employed as a Senior Ultrasonic Engineer at Herrmann Ultrasonics since November 2016. Prior to this role, Daniel worked as an Ultrasonic Engineer at the same company and as an Installation Supervisor at Elevadores Schindler Mexico S.A de C.V. and Mitsubishi Electric de México. Daniel also has experience as a Maintenance Consultant at chocolates escalona. Daniel holds a degree in Mechatronic Engineering from Universidad del Valle de México. Some of Daniel's achievements include automating machinery and expanding product range.
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Herrmann Ultrasonics
We are the Recognized Technology Leader and manufacturer of ultrasonic welding machines, generators and sonotrodes. The PLASTICS division offers solutions for the joining of injection molded thermoplastic parts. Ultrasonic welding is clean, safe and environmentally friendly. It is impossible to imagine industry without this joining technology in various market segments. We offer patented solutions for welding applications with the highest strength, precision and repeatability. The PACKAGING division offers fast and airtight ultrasonic packaging sealing solutions with a focus on high throughput and sustainability. Different materials and new packaging designs require continuous development of new economic solutions for the packaging industry. We develop and deliver the complete solution for the packaging machine and incorporate ultrasonic sealing – fast – safe – airtight. In addition, we offer solutions for food cutting by the use of ultrasonic knives. The NONWOVENS division offers applications for continuous production in the fields of bonding, laminating, embossing, perforating, sewing and cutting of nonwoven, foils, paper and filter materials. In close cooperation with our customers we have become the market leader by developing innovative ultrasonic components. The METALS division offers joining technology for nonferrous metals. Ultrasonic welding of nonferrous metals, such as copper and aluminum, is an established joining technology and is suitable for many applications in the fields of automotive, consumer products and electronics industry.