Herrmann Ultrasonics
Francois Laplaine - PMP Certified currently works as a Sales Engineer Plastics at Herrmann Ultrasonics, Inc. Francois previously worked as a Process Engineer at Danmare Group Inc, a Project Field Engineer at Pomerleau, a Building Project Engineer at GELÉ, a Project Engineer at SNC-Lavalin, a Field Engineer at Aqseptence Group France, and as an employee in a call center at Performance Marketing. Francois is currently pursuing a Master's degree in Systèmes industriels at Université de Poitiers and has a DUT GEII TOURS degree from Université de Tours.
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Herrmann Ultrasonics
We are the Recognized Technology Leader and manufacturer of ultrasonic welding machines, generators and sonotrodes. The PLASTICS division offers solutions for the joining of injection molded thermoplastic parts. Ultrasonic welding is clean, safe and environmentally friendly. It is impossible to imagine industry without this joining technology in various market segments. We offer patented solutions for welding applications with the highest strength, precision and repeatability. The PACKAGING division offers fast and airtight ultrasonic packaging sealing solutions with a focus on high throughput and sustainability. Different materials and new packaging designs require continuous development of new economic solutions for the packaging industry. We develop and deliver the complete solution for the packaging machine and incorporate ultrasonic sealing – fast – safe – airtight. In addition, we offer solutions for food cutting by the use of ultrasonic knives. The NONWOVENS division offers applications for continuous production in the fields of bonding, laminating, embossing, perforating, sewing and cutting of nonwoven, foils, paper and filter materials. In close cooperation with our customers we have become the market leader by developing innovative ultrasonic components. The METALS division offers joining technology for nonferrous metals. Ultrasonic welding of nonferrous metals, such as copper and aluminum, is an established joining technology and is suitable for many applications in the fields of automotive, consumer products and electronics industry.