Heinrich Heiss

Heinrich Heiss is a seasoned professional with extensive experience in the field of 3D sensing and semiconductor technology. From June 2005 to March 2021, Heinrich held various senior positions at Infineon Technologies, including Distinguished Engineer 3D Sensing, Lead Principal 3D Sensing, and Director of Technical Marketing and System Engineering for RF & Sensors. Prior to this, Heinrich was a PhD student at Technische Universität München from October 1986 to October 1996, focusing on the technology and device development of InP-based HEMT devices for high-frequency applications, as well as studying electrical engineering with a specialization in semiconductor devices, RF engineering, and electrophysics/optics.