Inspire Semiconductor, Inc.
Tim Heaton is an experienced engineer specializing in System on Chip (SoC) design, with a focus on advanced semiconductor technologies and architectures. Currently serving as the Lead SoC Design Engineer at Inspire Semiconductor, Inc. since July 2025, Tim previously worked as a SoC Design Engineer at Niobium Microsystems, implementing a PCIe Gen 4 endpoint for innovative zero trust computing frameworks. Earlier roles include Circuit Design Engineer at Centauri, where significant contributions were made to eFPGA integration and ASIC design, and Graduate Research Assistant at The Ohio State University, where Tim concentrated on asynchronous AES core development. Educationally, Tim holds a Master’s and Bachelor’s Degree in Electrical Engineering from The Ohio State University, complemented by early experience at Honeywell Technology Solutions and Texas Instruments.
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Inspire Semiconductor, Inc.
InspireSemi is an Austin-based chip design company that has built a technology foundation that delivers revolutionary performance, energy efficiency, versatility, and a thriving open software ecosystem. This enables us to address multiple diversified markets of High-Performance Computing (HPC), AI, and blockchain/cryptocurrency mining. It hasa unique and strongly differentiated accelerated computing solution compared to existing approaches for these markets.The Company is led by an accomplished team with a proven track record and is leveraging an efficient operating model with outsourced manufacturing partners (e.g.- TSMC). Leading industrial companies, national labs, computer OEMs, and crypto mining companies value our technology, innovative North America design team and predictable supply chain.