izmo micro: custom SiP & IC Packaging for high-density, high-performance systems.

Wide range of packaging options to accommodate diverse design specifications and functional requirements, including complex mixed-technology assemblies.

Meet izmo microsystems, the hi-tech semiconductor and systems company specializing in System-in-Package (SiP) miniaturization, with India based facilities for 3D packaging.

3D Technology

Electronics

Packaging Services

Semiconductor

izmo Microsystems

izmo Microsystems' headquarters in Bangalore, India

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