Hinns Benny

Package Design Engineer at Micron Technology

Hinns Benny is a Package Design Engineer at Micron Technology since March 2024, following a comprehensive internship as a Semiconductor Packaging Engineer at NXP Semiconductors. Having completed a Master of Science in Industrial Engineering at Arizona State University, Hinns also gained relevant experience as a Chemical Inventory Assistant and a Research Aide during academic tenure. Previous roles include a Sales and Marketing Intern at Aramark, a Travel Coordinator at Hinns Tours & Travels Pvt. Ltd, and a Subject Matter Expert for Chegg India. Hinns possesses a Bachelor of Technology in Mechanical Engineering from APJ Abdul Kalam Technological University and has engaged in practical projects involving finite element analysis and object-oriented programming.

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Boise, United States

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Micron Technology

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Micron Technology, Inc. is an American global corporation that produces many forms of semiconductor devices, including dynamic random-access memory, flash memory, and solid-state drives. Its consumer products are marketed under the brands Crucial and Ballistix. Micron and Intel together created IM Flash Technologies, which produces NAND flash memory.


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10,000+

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