The Millice Group (TMG), a Singapore Headquartered High Technology Distribution business with offices throughout USA, ASEAN, China, Japan. Our products range from Wafer Ingot Growing equipment, FAB Wafer handling and inspection (FABS) to Diced wafer handling and inspection (OSAT/BESemi). We also operate state-of-the-art manufacturing facilities located in Singapore and United States. Our own manufactured products include wafer dicing surfactants and advanced residue-free composite adhesive films, are globally accepted for use with all wafer and substrate materials, from Silicon to piezoelectric and compound materials and are used in the semiconductor dicing and wafer thinning markets.

Contact us to see how we can solve your most challenging needs. 

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