Marc Supinski

Marc Supinski has extensive experience in PCB and package design, currently serving as SMTS PCB & Package Design and Package and Board Layout Design Consultant at Ethernovia since August 2020. Throughout a career spanning several decades, Marc has held key roles including Senior Staff RF Package Designer at Peraso Technologies, Inc., and Sr. Electrical-Mechanical Engineer at Firan Technology Group Corporation. Additional positions include Senior PCB Design Consultant at Circuitbits Inc., Manager of Handheld Board Development at AMD, and various engineering and managerial roles at ATI, Integrated Technical Services, and MicroArt Services Inc. Marc’s diverse expertise encompasses RF package design, hardware/PCB layout design, PCB fabrication, and board assembly consultation.