Ken MacWilliams

Ken MacWilliams has held various executive positions throughout their career. From 2020 to the present, they have been the President and a Member of the Board of Directors at Multibeam Corporation. Prior to this, from 2018 to 2020, they served as the CEO of Yield Engineering Systems. From 2012 to 2018, Ken MacWilliams was a Member of the Board of Directors at Kateeva. Ken also held the role of Senior VP of Strategy and Growth Initiatives at Veeco Instruments from 2011 to 2017. Earlier in their career, Ken MacWilliams worked at Applied Materials from 2002 to 2011, where they held various Vice President roles in strategy, marketing, and general management. Ken began their career at Novellus Systems as the Director of Technology and Product Manager from 1996 to 1998, eventually becoming the Vice President and General Manager of the PECVD Business from 1998 to 2002.

Ken MacWilliams received their Bachelor of Science (BS) degree in Physics and Electrical Engineering (double major) from Clarkson University. Ken then went on to obtain a Master of Science (MS) degree in Electrical and Electronics Engineering from Stanford University. Ken continued their education at Stanford University, earning a Doctor of Philosophy (Ph.D.) in Electrical and Electronics Engineering.

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San Francisco, United States

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Multibeam Corporation

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Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special applications. It is the industry’s only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity. Innovated by patterning and wafer fab equipment experts, our systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.


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51-200

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