Dongsoo Moon

DongSoo (Ray) Moon is a seasoned professional with extensive experience in the semiconductor and packaging industries. Currently serving as a Senior Application Engineer at Nordson Corporation since December 2018, DongSoo specializes in scanning acoustic tomography technology, particularly for top-tier memory manufacturers such as Samsung Electronics and SK Hynix, focusing on non-destructive package inspection solutions. Prior roles include Application Engineering Manager at Synaptics, where DongSoo managed new package development and NPI programs, and Sr. Packaging Engineer at Micron Technology, overseeing production management of multi-stack die packages. DongSoo's career began at STATS ChipPAC Ltd. as an R&D Engineer, concentrating on IC packaging development. Educational credentials include a Master of Business Administration (MBA) from Aalto University and a Bachelor's degree in Electronic Material Engineering from The University of Suwon.