NUVIA
Muniaswamy Murugan is an accomplished engineer with extensive experience in integrated circuit design and physical design engineering. Currently serving as a Principal Engineer at Qualcomm since June 2022, Murugan previously worked at Intel Corporation as a SoC design engineer, specializing in multi-die floorplanning for discrete Graphic SoCs. Prior experience includes a significant role at Cypress Semiconductor Corporation, where Murugan held several titles, including Principal Engineer for Elect Design and Senior Principal Design Engineer, focusing on physical design and static timing analysis for WiFi and Bluetooth chips after the Broadcom IoT acquisition. Additional roles at Broadcom Limited and earlier positions at Cypress Semiconductor and Open Silicon further underscore a strong background in ASIC design and semiconductor engineering. Murugan earned a Bachelor of Engineering degree in Electronics and Communication Engineering from the College of Engineering Guindy, Chennai, in 2006.
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NUVIA
Nuvia develops processors intended to create high-performance silicon design for a compute-intensive world.It designs processing chipsets for data center servers, thereby delivering a faster, power-efficient, and secure experience to existing data center processors.