Dhananjay Gundapu Jayakrishnan

Dhananjay Gundapu Jayakrishnan has extensive experience in embedded software development and firmware design. Dhananjay started their career as a Software Engineer at Samsung Electronics, where they worked on Flash Translation Layer (FTL) development for SD and micro SD cards. Dhananjay later advanced to roles such as Lead Engineer, gaining expertise in FTL algorithms and onsite experience in South Korea. Dhananjay then joined ProGlove as an Embedded Software Developer, eventually moving up to the role of Tech Lead Embedded Software, where they led a firmware team in task management, communication, and product development. Prior to joining ProGlove, they completed an internship and Master Thesis at CommSolid, focusing on Power estimation and Modeling framework for NB-IoT wireless modems.

Dhananjay Gundapu Jayakrishnan holds a Bachelor of Engineering (B.E.) in Electrical, Electronics, and Communications Engineering from the College of Engineering, Guindy, obtained between 2006 and 2010. Following this, they pursued a Master of Science (MSc) in Embedded Systems at Eindhoven University of Technology from 2015 to 2016, and then a Master's degree in Embedded Systems at Turun yliopisto - University of Turku from 2016 to 2017. Dhananjay also obtained a certification in "C++ Templates and the STL" from LinkedIn in 2020.