Robert Driscoll

Packaging Engineer at Quantum-Si

Robert Driscoll has worked as a Packaging Engineer at Quantum-Si since November 2020. Prior to that, they worked as an Undergraduate Researcher and Research Assistant at UConn Health from May 2018 to August 2018. In 2019, they worked as a Device Engineer at the University of Connecticut from May 2019 to August 2019.

Robert Driscoll attended the University of Connecticut from 2016 to 2020, where they pursued a degree in Biomedical Engineering with a focus on Bioinstrumentation.

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Wallingford, United States

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Quantum-Si

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At Quantum-Si, they have a created a very unique environment where bright, highly committed individuals are given the freedom, ownership, and resources to solve tough problems and be the first to do new science.


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51-200

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