Saras Micro Devices
Ron Huemoeller has extensive work experience in the semiconductor industry. Their most recent position was as President and CEO of Saras Micro Devices, a role they began in 2023. Prior to this, they held the position of President at Nano Circuit Technologies, where they provided technology innovation services to semiconductor companies. Ron also served as Managing Director of Packaging Business Development at Applied Materials from 2020 to 2022. Before these roles, Huemoeller spent many years at Amkor Technology, Inc. in various leadership positions, including Corporate Vice President, Head of WWR&D and Technology Strategy. Ron began their career at Cray Computer Corporation as Director and Head Engineer of Printed Circuit Operations.
Ron Huemoeller completed their Bachelor of Science degree in Chemistry at Augsburg University from 1981 to 1985. Ron then pursued a Master's degree in Business Administration at Arizona State University from 1988 to 1991. Later, from 2004 to 2007, they obtained a Master's degree in Technology Management at the University of Phoenix.
Saras Micro Devices
At Saras Micro Devices, we are transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge, data-intensive applications like high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking and more. As packaging experts in the IC world, we understand your power delivery challenges and the technology behind them, and we’ve created a new way to power your innovations. Our novel approach for improving power delivery performance uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency. When you need packaging expertise to help you reach your power management goals, let us help you power the future.