LC

Lei C.

Firmware Engineer at Structo

Lei C. has been in the engineering field for over a decade, beginning with a Technician role at Measurement & Metrology Pte Ltd in 2008. After two years, Lei moved to Creative Labs as a Senior Technician in 2010. In 2015, Lei accepted a position as an Assistant Engineer at Hi-P International. After one year, Lei was promoted to Engineer at FTDI Chip in 2016. In 2019, Lei joined Avire as a Development Engineer. Most recently, Lei has been a Firmware Engineer at both Structo and STMicroelectronics since 2022.

Lei C. has a diverse educational background. Lei began their studies in 2006, when they earned a Nitec NTC-2 in Electronics (Computer & Networking) from the Institute of Technical Education (ITE). Two years later, they completed a Higher Nitec NTC-3 in Mechatronics Engineering from the same institution. In 2015, they earned a Diploma in Information Technology from Kaplan University. Finally, in 2017, Lei C. completed a Bachelor's degree in Cyber Forensics, Information Security and Computer Science from Murdoch University.

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Structo

Structo is a 3D printing solutions provider with a mission to bring digital factories of the future to life.


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51-200

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