Summit Interconnect
Clay Swain is the VP of Sales & Marketing at Summit Interconnect, where Clay oversees all sales and marketing activities for the company. Prior to their current role, Clay held various leadership positions in companies such as TTM Technologies, Tyco Printed Circuit Group, and ElectroStar. Clay holds a Master of Business Administration (MBA) and a Bachelor of Business Administration (B.B.A.) from Utah State University.
Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.