Summit Interconnect
Patrick MacPherson held the position of National Sales Manager at MEI for nearly 15 years before transitioning to their current role as Vice President of Sales in the Aerospace & Defense sector at Summit Interconnect. With 28 years of experience in the Printed Circuit Industry, Patrick utilizes their extensive knowledge of materials, HDI complexity, and IPC standards to drive successful development of PWB’s tailored for RF, Space, and HDI compliant products.
Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.