TECHNOPROBE
Hirofumi Nagata has extensive work experience in the semiconductor industry. Hirofumi is currently serving as the Senior Technical Director at Technoprobe, a position they have held since October 2019. Prior to this, Hirofumi worked at FormFactor for over 18 years. During their tenure at FormFactor, they held various roles including Director of Product Solution Engineering from October 2012 to October 2019 and Director of Design from July 2001 to October 2012. Before joining FormFactor, Hirofumi worked at Motorola for ten years as a Senior Staff Engineer. In this role, they were involved in project management for embedded EEPROM MCU development, chip design, wafer process, evaluation, and production setup. Hirofumi also contributed to the development of an embedded 16-bit MCU with Flash+EEPROM.
Hirofumi Nagata's education history is not fully provided. It is known that they attended an unspecified school from 1987 to 1991, but the school name, degree name, and field of study are not mentioned. Additionally, there is no information about their education after 1991.
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TECHNOPROBE
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Technoprobe is a microelectronic industry leader in the design, development, manufacture, sale and support of advanced semiconductor wafer probe cards. Leader in advanced probing solution for the microelectronics industry, with the Mission to be vital in the success of our customers, by enabling an early touch and insight in to the performance of their products and alignment to their roadmaps through the most advanced wafer probe testing solutions and the undisputed best service, delivery and reliability. Technoprobe has developed a product portfolio spanning from Cantilever and Vertical to MEMS needles precisely with the idea to satisfy all of the varying requests coming from our customers. We are continuously improving the level of our service, supporting our customers with a worldwide network that includes assembly and repair facilities in United States, Europe (Italy, France), Singapore, Taiwan, Philippines.