Moonsung Kim

MoonSung KIM is an experienced professional in the field of engineering, currently serving as the Production Innovation Group Leader at Telechips Inc since December 2007. Responsibilities encompass assembly packaging engineering, package design, production planning, purchasing, and outsourcing site management. Previously, MoonSung KIM worked as a Packaging Process Engineer at Amkor Technology Korea from January 1998 to December 2007, focusing on mold and backend processes as well as overall process control and monitoring. MoonSung KIM holds a degree in Mechanical Engineering from Soongsil University, graduating in 1998.