Tessolve
Kingsly Christopher is a seasoned engineering professional with extensive experience in test engineering, currently serving as Sr Director at Tessolve Singapore Lab since May 2022, after previously holding the position of Director of Test Engineering at Tessolve Engineering Services Pte Ltd. Kingsly leads a team responsible for pioneering testing solutions for various semiconductor devices and has a proven track record in transitioning automated test equipment and enhancing test efficiency. Prior experience includes establishing the test development team at Lynxemi Pte Ltd and contributing to the development of test software and hardware at Switchcore Singapore Pvt Ltd. Kingsly's career in test engineering began at STATS ChipPAC and SPEL Semiconductors Limited, showcasing a consistent focus on technical innovation and team leadership. Kingsly holds a Master’s Degree in Microwave and Optical Engineering and a Bachelor’s Degree in Electronics and Communication Engineering from Madurai Kamaraj University.
This person is not in any teams
This person is not in any offices
Tessolve
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.