Tessolve
Sarit Das is a seasoned finance professional with extensive experience spanning over 15 years in various roles within financial management and strategy. Currently serving as Senior Director of Finance at Tessolve since December 2019, Sarit has held multiple strategic positions, including Director of Business Finance and Associate Director of Finance. Prior to Tessolve, Sarit worked at Mindteck as Senior Manager Finance, where responsibilities included developing financial strategies and improving productivity. Experience at Dentsu Aegis Network involved analyzing client profitability and revenue growth opportunities while assisting Global Client CFOs. Sarit has also contributed significantly in finance roles at Synovate and Phillips Carbon Black Limited, with a focus on financial planning, decision support, and budgeting. Education credentials include an Executive Programme in Strategy & Leadership from the Indian Institute of Management, Indore, a Chartered Accountant designation, and a Master's degree in Finance from the University of Rajasthan.
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Tessolve
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.