Tessolve
Shashank Rao Pakala has extensive experience in sales and business development within the semiconductor and technology sectors. Currently serving as Senior Manager at Tessolve since February 2020, Shashank oversees key Tier-1 semiconductor accounts and customer engagements in VLSI and embedded systems across Hyderabad and Bangalore. Prior to this, Shashank was the Hyderabad site head and Senior Manager at Test and Verification Solutions from April 2015 to February 2020, managing significant semiconductor and automotive clients in India and Europe while developing growth strategies focused on financial gain and customer satisfaction. Shashank began a career in business development at Mirafra Technologies, engaging with major clients such as Qualcomm and Accenture. Shashank holds a Bachelor's degree in Information Technology from Jawaharlal Nehru Technological University, earned between 2005 and 2009.
Tessolve
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.