Tessolve
Sonalika Krishnam is a Senior Design Engineer at Tessolve, working on SoC projects for Texas Instruments since May 2022. Previously, Sonalika held the position of Senior Design Verification Engineer at Wipro, focusing on design verification for 200G Ethernet at the block level and developing feature test cases from June 2021 to April 2022. Prior experience includes serving as an IP Verification Engineer at INVECAS from December 2018 to June 2021, with a focus on customer application engineering and validation for AMBA protocols, as well as a brief contract with Synopsys. Earlier career stages include training as an Engineer Trainee at VEDA IIT in 2018 and an internship at ECIL in April 2017. Sonalika holds a Bachelor of Engineering degree in Electronics and Communication from Jntu Vizianagaram, completed in 2018, and earlier education includes intermediate studies in MPC at Sri Chaitanya Jr College and schooling at Gayatri Model High School.
Tessolve
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3000+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.