Texas Institute for Electronics
Tim Cowles, BSEE, MBA, currently serves as the Executive Director of Product Development Engineering at the Texas Institute for Electronics, which emphasizes advanced package solutions through heterogenous integration. Previously, Tim held multiple leadership roles at Microsoft from August 2019 to November 2023, including Director of Memory Sourcing Engineering for Azure CSCP and Director of Cloud Memory & Storage Engineering, where responsibilities included memory and storage hardware configurations and aligning supplier roadmaps. Tim's extensive experience at Micron Technology spanned nearly three decades, culminating in the role of Director of Product Engineering Silicon Strategy, overseeing the DRAM scaling roadmap and engineering processes for a large global team. Tim's educational background includes a Bachelor of Science in Electrical and Computer Engineering from Washington State University and a Master of Business Administration from Boise State University.
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Texas Institute for Electronics
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TIE’s Vision: Innovate semiconductor solutions through advanced Heterogeneous Integration (HI) TIE’s Mission: Establish a non-profit, open-access semiconductor accelerator to: - Develop and execute a state-of-the-art 3DHI manufacturing technology roadmap - Provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth - Reinvent and expand pathways for an inclusive workforce and make Central Texas a premier hub for comprehensive workforce development - Scale-up TIE technologies through partnerships with domestic fabs and OSATs