Amkor Technology
Jingjing Song currently serves as Director of Test TPM at Amkor Technology, Inc., since June 2022, providing ATE test-related services to support the European sales team by analyzing test requirements and managing product introductions globally. Previously, Jingjing held the position of Senior Manager OSAT Engineering at Infineon Technologies from February 2013 to June 2022, overseeing subcontractors to ensure compliance and partnering in package development. Additionally, Jingjing contributed as Principal Engineer in Test Concept and Development, defining test flow strategies for 5G Infrastructure products and achieving significant cost savings. Earlier career experience includes a role as Principal Engineer in test development at Lantiq Deutschland GmbH and Siemens HL, specializing in test development for various ICs and gaining proficiency in multiple ATE platforms.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.