Amkor Technology
Tony Tsao has extensive experience in quality management and operations, currently serving as President and previously holding positions such as Operation General Manager and Country Quality Head at 艾克爾國際科技股份有限公司 since May 2010. Prior experience includes a role as QA Department Manager at Maxchip Electronics Corp. from May 2009 to May 2010, where responsibility focused on quality system and SPC management. Additionally, Tony Tsao worked at TSMC from July 2000 to August 2008 as section manager in the Quality System Management Division, overseeing SPC system management across all fabs. Educational qualifications include a Master of Science in Statistics from National Tsing Hua University, earned between 1992 and 1994.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.